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Figure 1. Electrostatic self-assembly flow diagram of diethyltriamine (DETA) synchronously aminated reduced graphene oxide and its oppositely charged emulsion particles.
Figure 2. (a) Hexagonal BN @ functionalized graphene structure diagram; (b) Schematic diagram of the thermal conductivity of the composite; (c) Simulation of the heat dissipation effect of the composite material in actual electronic devices.
Figure 3. (a) Raman diagram of the bilayer structure formed by hexagonal boron nitride and functionalized graphene; (b) Schematic diagram of the thermal conductivity of the composite; (c) Simulation of the heat dissipation effect of the composite material in actual electronic devices.
Figure 4. Selective distribution of thermally conductive components
Recently, the Advanced Materials Center R&D team of the Institute of Applied Technology of the Chinese Academy of Sciences’ Institute of Applied Physics has made progress in the research of advanced electronic packaging materials. The relevant results were published in Composites Part A: Applied Science and Manufacturing, Material Research Express, and Composites Part A. : Applied Science and Manufacturing, Composites Part A: Applied Science and Manufacturing.
The new processor is running faster and faster, and the energy consumption of high-performance instruments is increasing. This forces the development of cheap "auxiliary substrates" or "dependent devices". Thermal management technology has gradually become an important consideration for engineers. The problem is that there is a growing demand for highly thermal insulating materials used as packaging and thermal interface materials in insulation applications. The semiconductor tube and the heat sink are packaged, the protection of the die, the sealing of the shell, the heat conduction and insulation of the rectifier and thermistor, the thermal insulation assembly of the multilayer board in the micro package, and the new high heat-dissipation circuit board etc. Thermal insulation material for process performance. It is very important to research and develop thermal conductive materials with high thermal conductivity and excellent mechanical properties.
Graphene, carbon nanotubes and other carbon materials have excellent heat transfer properties, but their electrical conductivity limits their use in electronic materials. Hexagonal boron nitride (hBN), as the isoelectronic body of graphene, has a certain energy gap, a flat atomic level surface, and no dangling bonds on the surface, and is suitable for hybridizing with graphene through non-covalent bonds. The research group designed a self-assembled series of graphene/hBN hybrid structures without damaging the material structure (Figure 1-3). The use of thermally conductive components is selectively distributed in the polymer to obtain an insulating thermally conductive hybrid structure (Figure 4). Through simulation, the application feasibility of the hybrid material in the field of heat dissipation was verified. This kind of polymer matrix composite material has excellent heat transfer performance and electrical insulation performance. The material has broad application prospects in the field of advanced electronic packaging and thermal management.
Based on the above work, Tian Xingyou, a researcher at the Hefei Research Institute's Institute of Applied Sciences, presided over a national key R&D project, and will lead the task force to further develop the research and application of thermal conductive substrate materials.
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